Maflow cooperates with the largest research institute in Europe


Boryszew SA Maflow Branch in Tychy together with the Fraunhofer Institute for Material and Beam Technology IWS is working on the development of laser welding technology for components that are included in products manufactured by the Branch.
In the future, the achieved process parameters will allow the use of technology that is several times faster than the currently used, which shall reduce the production costs and improve product’s quality.

The undergoing activities include the project of joining the components and process, which shall be completed with conducting welding tests under laboratory conditions. The project shall be ended with defining the process and its key parameters. The research conducted so far focused on testing the number of parameters aiming at selecting future technology in a way that eliminates defects and ensures high efficiency of both the future process and the product.

“Constant development is the key aim of Boryszew Group. This is evidenced by intensive activities in the area of R&D. The works conducted together with the prestigious Fraunhofer Institute IWS guarantee the effective use of funds and building lasting cooperation between science and business. Fraunhofer is one of the best Institutes when it comes to shaping the structure of research dedicated to the economy,” said Piotr Lisiecki, Chairman of the Board of Boryszew SA.

The Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS Dresden stands for innovations in laser and surface technology. As an institute of the Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.  V., IWS offers one stop solutions ranging from the development of new processes to implementation into production up to application-oriented support. The fields of systems technology and process simulation complement the core competencies. The business fields of Fraunhofer IWS include PVD and nanotechnology, chemical surface technology, thermal surface technology, generation and printing, joining, laser ablation and separation as well as microtechnology. The competence field of material characterization and testing supports the research activities.


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